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Blog Posts Tagged Heat Transfer Module

Analyzing Heat and Mass Transfer During Cake Baking with Simulation

April 26, 2017

As you bake a cake, there are many complex heat and mass transport processes taking place behind the oven door. Take a closer look at the art and science involved in the cake baking process…

Simulating the Electrothermal Transients in Superconducting Magnets

March 9, 2017

In order to design superconducting magnets for a particle accelerator, such as the Large Hadron Collider at CERN, researchers need to simulate and optimize their electrothermal transients.

How to Analyze Thermoelectric Cooler Designs with a COMSOL App

March 8, 2017

A simulation application, such as one for a thermoelectric cooler design, can be used to test a variety of parameters in order to optimize a device for a specific use.

Analyzing Utility Boiler Designs by Simulating Radiative Heat Transfer

March 6, 2017

To study a utility boiler furnace, you need to account for the effects of radiation, which is difficult to solve for analytically and study experimentally. That’s where simulation comes in.

How to Model the Electromagnetic Heating of Underground Cables

February 14, 2017

Underground power cables are beneficial in many ways, but they are also subject to overheating. To design better cables, we can model their electromagnetic heating in COMSOL Multiphysics.

Finding the Best Coal Arrangement for Even Heat in a Grill

January 25, 2017

Pizza on the grill? It’s actually quite delicious. Here, we use heat transfer modeling to determine how the grill’s coals should be arranged for even heating.

Introduction to Modeling Natural Convection in COMSOL Multiphysics®

December 23, 2016

Electronics cooling, indoor climate systems, and environmental transport problems all rely on natural convection. Get an introduction to modeling this phenomenon in COMSOL Multiphysics®. 

Optimize 3D Printers by Modeling the Glass-Transition Temperature

December 22, 2016

Interested in 3D printing? Find out how researchers from Bangladesh and the United States analyzed a 3D printer head via heat transfer simulation.


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