Thermal Management in Electronic Devices with COMSOL Multiphysics® - Archived

Originally aired on 
September 18, 2024

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The ability to dissipate heat is one of the most important features of modern electronic devices and is usually a limiting factor in the miniaturization of these devices.

Designing power electronics and electronic consumer devices involves having to balance strict space and temperature design constraints with the need to implement several heat sources, such as microchips and battery packs. Simulation can be used to address the engineering challenge of fitting the different electronic components in ever-smaller form factors while also ensuring the system remains below critical temperatures.

In this archived webinar, we will discuss simulating heat transfer by conduction, convection, and radiation using the Heat Transfer Module, an add-on product to the COMSOL Multiphysics® simulation software. We will also present some options for explicitly modeling heat sources, such as electrochemical and electromagnetic sources.

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To register for the event, please create a new account or log into your existing account. You will need a COMSOL Access account to attend Thermal Management in Electronic Devices with COMSOL Multiphysics®.

For registration questions or more information contact info-in@comsol.com.

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Archived Webinar Details

This is a recording of a webinar that originally aired on September 18, 2024