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Thermal Analysis of Circuit Boards

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Hello everyone,

I am a very new user to COMSOL Multiphysics and I represent a group of students attempting to use the program to conduct thermal analysis on PCBs in a CubeSat. To conduct the thermal analysis we currently design the boards in SolidWorks using basic geometries for heat producing components (Cubes and such). We then model the components in COMSOL as “heat sources” inputting Q as power dissipated by the component divided by volume. We set the materials of the component as the primary material of the component (Most are silicon). We further simulate convection ht via an inward heat flux on all surfaces inputting h. Are results, though are off and unrealistic in many different simulations. My question, is there an easier way to conduct this analysis? Are we simplifying are model too much that it becomes inaccurate? Are we missing anything?

I understand that this is a broad question, but I would appreciate any help anyone can provide. I can post one of my COMSOL files if it would help to see exactly what we are doing.

Thanks

4 Replies Last Post Jan 23, 2011, 10:36 a.m. EST

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Posted: 1 decade ago Jan 19, 2011, 3:35 p.m. EST
There is a CubeSat Forum:
cubesat.ifastnet.com/forum

If you ask the same question there, somebody with experience in thermal analysis but also in CUBESATS could answer you question or at least offer you some suggestions.
There is a CubeSat Forum: http://cubesat.ifastnet.com/forum If you ask the same question there, somebody with experience in thermal analysis but also in CUBESATS could answer you question or at least offer you some suggestions.

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Posted: 1 decade ago Jan 19, 2011, 9:51 p.m. EST
Thank you for your help. Does anyone else have any other tips or knowledge of the subject at hand?
Thank you for your help. Does anyone else have any other tips or knowledge of the subject at hand?

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Posted: 1 decade ago Jan 23, 2011, 12:42 a.m. EST
You got an answer on that forum I mentioned.
You got an answer on that forum I mentioned.

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Posted: 1 decade ago Jan 23, 2011, 10:36 a.m. EST
Thanks. I have saw that and I am responding accordingly.
Thanks. I have saw that and I am responding accordingly.

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