Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.
Polymer thermal stress analysis, error: Out of memory during assembly
Posted Sep 14, 2017, 10:38 a.m. EDT Structural & Acoustics, Heat Transfer & Phase Change Version 5.3 1 Reply
Please login with a confirmed email address before reporting spam
Dear all,
I have confronted a problem when I wanted to simulate the polymer cooling process with "thermal stress" simulation. The Error showed: Out of memory during assembly. I noticed that the comsuming RAM was increasing quite fast when the simulation starts, then the RAM memory is not enough. I noticed that when I just simulate the thermal process, everthing was good. Only when coupling with the Solid Mechanics study, the problem happened. Could anyone give me some suggestions about the reason? I would assume it to be BC setting or multiphysics coupling. I would attacht the model here as well. Thanks!
Attachments:
Please login with a confirmed email address before reporting spam
Hi Sijie,
I would advise you to ask your question at support@comsol.com. For now I can tell you that there are a lot of issues with that model:
-It is 24 MDOF! -At least two symmetries can be employed, but probably it is actually 2D. -If it is 3D, swept mesh is better. -No constraints on Solid Mechanics => singular. -The last branch of the viscoelastic model is probably unnecessary, given the long relaxation time compared to the analysis time.
Regards,
Yara Soares