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Thermal/mechanical simulation of two layers: how can COMSOL 'seperate' them due to different CTEs?
Posted Feb 15, 2018, 4:08 a.m. EST Semiconductor Devices, Structural & Acoustics, Structural Mechanics Version 5.3a 2 Replies
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Dear Community,
I am trying to simulate the following case with COMSOL 5.3a. I have a 2D design of a Si wafer, with a layer of SiO2 on top of it (as shown in the picture). I want to apply different temperature values and find out at which T the two materials start to seperate from each other due to different CTEs; hence it is a thermal-mechanical study case.
However, I do not know how can I simulate that with COMSOL; the program shows me how the two materials expand due to elevated T as a unity, there is no 'seperation' between them.
Any help is welcome. Thank you in advance.
Kind regards,
Dimitrios
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Dear Dimitros,
I would suggest you check out these two tutorial models:
https://www.comsol.de/model/thermal-expansion-in-a-mems-device-1870 https://www.comsol.de/model/mixed-mode-debonding-of-a-laminated-composite-19961
My impression is that a combination of these two could be an approach to the process you want to model.
Regards, Andreas
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Hello Andreas,
thank you for the links! They seem really helpful!
Kind regards,
Dimitrios