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Modeling assembly process

Posted Jul 24, 2018, 4:32 p.m. EDT MEMS & Nanotechnology, Structural & Acoustics, General, MEMS & Piezoelectric Devices, Geometry, Mesh, Structural Mechanics Version 5.3a 0 Replies

Ben Gholami
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Hi all,

I'd like to simulate an assembly process (soldering) in microelectronics packaging which follows these steps:

1) A substrate and a metal lid are separately heated to temperature T1 2) The substrate and the lid get connected by a thin layer of solder 3) The whole package is cooled down to T2

I'd like to see how the residual stresses look like in the whole system after the assembly process. I'd be thankful to know your thoughts.

Regards, Ben

0 Replies Last Post Jul 24, 2018, 4:32 p.m. EDT
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