Note that while COMSOL employees may participate in the discussion forum, COMSOL® software users who are on-subscription should submit their questions via the Support Center for a more comprehensive response from the Technical Support team.
-
Thermal stress increases 10x for just 1 K temperature rise in Diaphragm based MEMS Pressure Sensor model, what could cause this?
read0 Replies 12 ViewsMEMS & Piezoelectric DevicesHeat TransferStructural Mechanics
Anmol Kumar Gupta posted 4 hours ago
-
3 Replies 38 Views
Studies & SolversStructural MechanicsPhysics Interfaces
Tinsae Behaga posted 2 days ago reply 5 hours ago by Henrik Sönnerlind
-
1 Replies 21 Views
Anushka Mahajan posted 11 hours ago reply 8 hours ago by Edgar J. Kaiser
-
2 Replies 69 Views
GeometryMeshModeling Workflow
Eun Jeon posted 5 days ago reply 5 days ago by Eun Jeon
-
1 Replies 46 Views
Samjhana Sharma posted 5 days ago reply 5 days ago by Robert Koslover
-
1 Replies 29 Views
Version 6.4 ElectromagneticsCharged Particle TracingModeling Workflow
Ritik Singh posted 6 days ago reply 5 days ago by Henrik Sönnerlind
-
1 Replies 29 Views
Version 6.4 Electrochemistry
StreamLine posted 6 days ago reply 6 days ago by José Dinarte Vieira Goulart
-
1 Replies 41 Views
Version 6.4 Fluid & Heat
Delika Weragoda posted 7 days ago reply 7 days ago by Robert Koslover
-
5 Replies 232 Views
Version 5.5 MaterialsStructural MechanicsMaterial Models
Aditya Udgaonkar posted 1 month ago reply 1 week ago by Henrik Sönnerlind
-
0 Replies 24 Views
Semiconductor DevicesInterfacingPhysics Interfaces
Manas Singh posted 1 week ago
