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Bond wire - Deformation and Parametric sweep

Posted Dec 15, 2015, 4:38 a.m. EST 2 Replies

Pavithra Rajasekar
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Hello

I designed an Al Bondwire on a Silicon chip with DBC. The physics were heat transfer in solids, solid mechanics and thermal expansion. I chose the copper base for the Inward heat flux with h = 10 W/m2.K
and external temp Text as 293.15 and current through the bond wire as 2A. I got some results but when i did a parametric sweep gradually increasing the Text and Current, the results remain the same, as if there is no effect of the parametric sweep. I have attached the images. If anyone can help me figure it out i would appreciate it.

Thanks in advance.
2 Replies Last Post Dec 16, 2015, 9:16 a.m. EST
Krishnaswamy Veluswamy
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Posted: 9 years ago Dec 15, 2015, 1:09 p.m. EST
Hi,

I think you need to upload your model and provide the version of it, so that someone might help.
because, it depends on how you define the sweep, inorder someone might help you.
Hi, I think you need to upload your model and provide the version of it, so that someone might help. because, it depends on how you define the sweep, inorder someone might help you.
Jeff Hiller COMSOL Employee

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Posted: 9 years ago Dec 16, 2015, 9:16 a.m. EST
Be aware of the scaling factor used to display deformed geometries. See for instance www.comsol.com/community/forums/general/thread/92481/#p220222
Best,
Jeff
Be aware of the scaling factor used to display deformed geometries. See for instance http://www.comsol.com/community/forums/general/thread/92481/#p220222 Best, Jeff

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