The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This example demonstrates how to model coupled flow, heat transfer, and structural deformation and stress in a pipeline network. Gravity loads from the pipe and fluid are also taken into account. Read More
This app demonstrates the following: Geometry parts and parameterized geometries Sending an email with a report when the computation is finished User-defined email server settings which is useful when running compiled standalone applications Options for setting different mesh sizes ... Read More
Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, ... Read More
This model is intended as a first introduction to simulations of fluid flow and conjugate heat transfer. It shows you how to: Draw an air box around a device in order to model convective cooling in this box, set a total heat flux on a boundary using automatic area computation, and ... Read More
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... Read More
This study simulates the thermal behavior of a computer Power Supply Unit (PSU). Most of such electronic enclosures include cooling devices to avoid electronic components to be damaged by excessively high temperatures. In this model, an extracting fan and a perforated grille cause an air ... Read More
This example computes the effectiveness of a porous microchannel heat sink over a conventional microchannel heat sink. The model is fully parameterized. A parameter study on the thickness of the porous substrate is used to determine the optimal configuration. Read More
The inductor is a common component in a variety of electrical devices. Its applications include power transformation and measurements, and it can also be used together with capacitors to create oscillators. In small devices with many components, such as in laptops, heat generation can ... Read More
This app demonstrates the following: Geometry parts and parameterized geometry A results table form object containing outputs Finned pipes are used for coolers, heaters, or heat exchangers to increase heat transfer. They come in different sizes and designs depending on the ... Read More
This example models the transient heating, and final temperature, of a disc brake of a car in brake-and-release sequence. It is important to model the transient heating and the following convective cooling to determine the minimum interval between a series of similar brake engagements. ... Read More