The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... Read More
For several high-precision applications, especially in hydraulic systems and fuel injectors, micro bores are needed. In most cases the shape of the injection hole, especially the edge rounding, has a significant influence on the atomization of fluids and therefore on the combustion ... Read More
Tutorial model of electroplating. The model uses secondary current distribution with full Butler-Volmer kinetics for both anode and cathode. The thickness of the deposited layer at the cathode is computed as well as the pattern caused by dissolution of the anode surface. Read More
This is a model of the secondary current distribution in a zinc electrowinning cell. The model investigates the impact on the current distribution when changing the electrode alignment in a parametric study. The geometry is in 2D. Read More
When anodizing aluminum, the surface is electrochemically altered to form an abrasive and corrosion-resistive Al2O3 film. The electrode kinetics during the process are only marginally affected as the oxide layer grows, so a stationary analysis of the current distribution is sufficient to ... Read More
This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated. Read More
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... Read More
This example simulates electroplating of a printed circuit board (PCB) in 3D using the Secondary Current Distribution interface. In order to achieve thickness uniformity across the PCB, a dummy pattern is included in the design, along with an aperture in the electroplating bath. Read More
Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions ... Read More
This example shows how to model secondary current distribution and electrode growth with a moving geometry. To avoid numerical instabilities, a seed layer is introduced in the initial geometry to obtain a right angle at the edge between the growing electrode and the insulator. Read More