The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... Read More
This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the ... Read More
This model shows how to compute an array of borehole heat exchangers (BHEs) for shallow geothermal energy production. The BHEs are simplified as line heat sinks with a uniform heat extraction rate. The array is embedded into a layered subsurface model with groundwater flow in one of the ... Read More
The layout of a district heating network is designed using topology optimization. Read More
Thermoelectric elements are often used to cool or heat electronic components to a desired temperature. In such simulations, you are typically not interested in the behavior of the thermoelectric element itself but want to use its performance characteristics to model the overall response ... Read More
Electronic equipment often has to be certified to function after having been subjected to a specified shock load. In this example, the effect of an 50g 11ms half sine shock on a circuit board is investigated using response spectrum analysis. The results are compared with a time domain ... Read More
Heat pipes are designed to transfer heat efficiently through vaporization, mass transfer, and condensation of a working fluid. They are found in a wide variety of applications where thermal control is of importance, with cooling of electronics being a prominent example. Inside a heat ... Read More
This model simulates the velocity of the ionic wind generated by a wire-to-wire corona discharge. Ionic wind, created by the movement of charged particles in an electric field, can be harnessed for various applications, including cooling electronic components and enhancing heat ... Read More
In modeling of transport by diffusion or conduction in thin layers, we often encounter large differences in dimensions of the different domains in a model. If the modeled structure is a so-called sandwich structure, we can replace the thinnest geometrical layers with a thin layer ... Read More
In every system where there is conduction of electric current, and where the conductivity of the material is finite, there will be electric heating. Electric heating, also referred to as Joule heating, is in many cases an undesired by-product of current conduction. This model simulates a ... Read More