The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This example presents transient analysis of the wave propagation in rock mass caused by a short duration load on the surface. Such loads are typical during tunnel constructions and other excavations using blasting. The example shows the use of the Low-reflecting boundary conditions to ... Read More
This example shows how to use response spectrum analysis to verify the integrity of a structure that is exposed to an earthquake. The building is modeled as a steel frame, using beam elements. Displacements and stresses are computed. Read More
A contactor wedge is subject to a gravity load and is forced to slide due to a boundary load over a rigid target wedge surface, both infinitely wide. Horizontal linear springs are also connected between the left vertical boundary and the ground. This is a large sliding problem including ... Read More
This model calculates the eigenfrequencies and mode shapes of an unconstrained cylinder in axisymmetry. The model is taken from NAFEMS Free Vibration Benchmarks. The eigenfrequencies are compared with the values given in the benchmark report. Three different physics interfaces are ... Read More
This is a conceptual model illustrating how to couple fluid-structure interaction, heat transfer, and thermal expansion. A bimetallic strip in an air channel is heated so that it bends. After some time, an airflow with an inlet temperature which varies in time is introduced. As a ... Read More
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Read More
In this example, the homogenized elastic and viscoelastic properties of a particulate composite are computed based on the individual properties of elastic particles embedded in a viscoelastic matrix. Periodic boundary conditions are applied to a unit cell of the particulate composite ... Read More
In this tutorial model, the flow in a pipe with a bend is computed using the Pipe Flow interface. The computed fluid load is used as input to a stress analysis in the Pipe Mechanics interface. Gravity loads from the pipe and fluid are also taken into account. Read More
Including circumferential displacements in a 2D axisymmetric Solid Mechanics interface allows to compute twist and bending deformations. This model determines stress concentration factors for a hollow shaft for load cases of axial extension, torsion, as well as bending, using a ... Read More
In this benchmark example, a semi-elliptical crack at the inner surface of a cylinder is studied. The inside of the cylinder and the crack faces are subjected to a pressure load. The J-integral is calculated along the crack front, and the stress intensity factor is then compared with the ... Read More