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3D Multiphysics Model of Thermal Flow Sensors
Published in 2014
The aim of this work is to present a model capable to describe the behaviour of a thermal flow sensor under every physical aspect.
A generic thermal flow sensor relates the flow properties with a variation in the temperature profile inside the device itself. Thus, it is locally heated up with a resistive element biased with an external current, surrounded by one or more temperature sensing elements.
The analysis involves three different and coupled physic domains: electric current, heat transfer in solids and laminar flow. Once ready, it has been used to model an existing SOI CMOS MEMS wall shear stress sensor. Results shows a perfect agreement with the experimental data under every condition, proving the validity of the model.
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- falco_presentation.pdf - 0.59MB
- falco_poster.pdf - 1.21MB
- falco_paper.pdf - 1.79MB
- falco_abstract.pdf - 0.96MB