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See How Multiphysics Simulation Is Used in Research and Development

Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.

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Computational Fluid Dynamics

Virtual Experiments: Numerical Computations as a Powerful Tool for Engineers

P. Schmitz[1], A. Cockx[2], S. Geoffroy[3], and J. Gunther[1]
[1]Biochemical Engineering Dpt., Université de Toulouse, Toulouse, France
[2]Chemical Engineering Dpt., Université de Toulouse, Toulouse, France
[3]Mechanical Engineering Dpt., Université de Toulouse, Toulouse, France

An undergraduate course is developed to initiate future engineers to multiphysics numerical simulation by approaching concrete cases in various fields such as: heat transfers, fluid flow, mechanics, chemistry and electrostatics. The so called “Virtual Experiments” course consists of four ... Read More

The Use of COMSOL in Teaching Heat and Moisture Transport Modeling in Building Constructions

A.W.M. van Schijndel[1] and H.L. Schellen[1]
[1]Eindhoven University of Technology, Eindhoven, The Netherlands

This paper presents the use of the multiphysics package COMSOL for teaching heat and moisture transport modeling in the research area of building physics. It includes a description on how COMSOL works and six exercises with 2D, 3D, steady state and transient models. It is concluded that ... Read More

Simulations of Scanning Electrochemical Microscopy Experiments in Pure Negative and Positive Feedback Mode with Ring Microelectrodes

J. Mauzeroll[1], M. Mayoral[1], and D. Fabre[1]
[1]Department of Chemistry, Université du Québec à Montréal, Montreal, Quebec, Canada

Scanning electrochemical microscopy (SECM) is a powerful tool recently developed for studying structures and processes in micrometer and submicrometer sized systems. It can probe electron, ion, and molecule transfers, and other reactions at solid-liquid, and liquid-liquid, interfaces . ... Read More

COMSOL Derived Universal Scaling Model For Low Reynolds Number Viscous Flow Through Microfabricated Pillars – Applications to Heat Pipe Technology

N. Srivastava[1], and C.D. Meinhart[1]
[1]Department of Mechanical Engineering, University of California Santa Barbara, Santa Barbara California, USA

Cooling of high-power density electronic devices remains a challenge. Microfluidic heat-pipes with the potential of achieving ultra-high thermal conductivities offer a low-cost technology for cooling electronics. To achieve high thermal conductivity, it is critical to maximize the rate ... Read More

Studying Transition Flows for Low Prandtl Number Fluids

H. Jamai[1], A. Elamari[1], M. El Ganaoui[2], F.S. Oueslati[1], B. Pateyron [2], and H. Sammouda[3]
[1]LETTM, Département of physics, F.S.T, Tunisie
[2]SPCTS UMR CNRS, Faculte of Sciences, Limoges, France
[3]ESST-H., Sousse, Tunisie

COMSOL Multiphysics is offering an important alternative to home codes for modeling and simulation of complex problems with including coupled effects on heat and mass transfer. The present work focuses on low Prandtl number fluid melts subject to symmetry breaking and transition to ... Read More

3-D COMSOL Analysis of Extruder Dies

E. Solomon[1] and V. Mathew[1]
[1]Arcada University of Applied Sciences, Espoo, Finland

Three-dimensional flow analysis was performed by using COMSOL Multiphysics Chemical Engineering Module for the purpose of analyzing the flow properties and finding out the operating points of a test domain. Using material property table for an exemplary melt of LDPE (Low-Density ... Read More

Assessment of COMSOL Capabilities to Analyse the Thermo- Hydrodynamic Behaviour of the MSR Core

A. Cammi[1], V. Di Marcello[1], C. Fiorina[1], and L. Luzzi[1]

[1]Nuclear Engineering Division, Department of Energy, Politecnico di Milano, Milano, Italy

The present work is aimed at evaluating the capabilities of COMSOL Multiphysics® to treat heat transfer in Molten Salt Reactors (MSR). The analyzed situation is represented by the molten salt in turbulent regime flowing through a cylindrical channel surrounded by graphite, with both ... Read More

Modelling Thermal Time-of-Flight Sensor for Flow Velocity Measurement

O. Ecin[1], E. Engelien[2], M. Malek[2], R. Viga[2], B. Hosticka[1], and A. Grabmaier[2]

[1]Institut of Mikroelektronische Systeme, University Duisburg-Essen, Duisburg, Germany
[2]Institut of Elektronische Bauelemente und Schaltungen, University Duisburg-Essen, Duisburg, Germany

This communication reports on a numeric fluid dynamics simulation on a pipe flow model. The basic background is to determine the velocity of a flowing fluid in a pipe by using the Thermal Time-Of-Flight (TTOF) method on water. The visualization of the temperature and velocity ... Read More

Gravity-Driven Film Flow: Design of Bottom Topography

C. Heining[1] and N. Aksel[1]

[1]Applied Mechanics and Fluid Dynamics, University of Bayreuth, Bayreuth, Germany

We study the gravity-driven film flow of a Newtonian liquid down an inclined plane. Many applications such as heat- and mass exchangers and evaporators or film coaters require undulated or rippled bottom topographies. In these cases, the interplay of gravity, surface tension and inertia ... Read More

CFD Analysis of Loss Of Vacuum Accident for Safety Application in Experimental Fusion Reactor Facility

C. Bellecci[1], P. Gaudio[1], I. Lupelli[1], A. Malizia[1], M.T. Porfiri[2], R. Quaranta[1], and M. Richetta[1]

[1]EURATOM, Faculty of Engineering, University of Rome “Tor Vergata”, Roma, Italy
[2]ENEA Nuclear Fusion Tecnologies, Frascati, Roma, Italy

In an experimental nuclear fusion facility dust is generated both during normal machine operations and by macroscopic erosion of the plasma facing materials due to intense thermal loads. This dust can be mobilized by air ingress in case of LOVA (Loss of Vacuum Accident) threaten safety ... Read More

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