5000+ Technical Papers and Presentations on Multiphysics Simulation

Modeling the Hyperloop with COMSOL®: on the Design of the EPFLoop Pressurized Systems

Z. Sajó [1], L. Benedetti [1], N. Riva [1],
[1] EPFL - EPFLoop, Lausanne, Switzerland

The Hyperloop is a concept system targeting passenger transportation aiming to carry people in a pod running in a high vacuum tube at 1200 km/h. In 2015, SpaceX announced that they would sponsor a Hyperloop pod design competition, because of their interest in helping to accelerate the ... Read More

Modeling the Hyperloop with COMSOL®: on the Aerodynamics Design of the EPFLoop Capsule

N. Riva [1], L. Benedetti [1], Z. Sajó [1],
[1] EPFL - EPFLoop, Lausanne, Switzerland

The Hyperloop is a concept system targeting passenger transportation aiming to carry people in a pod running in a high vacuum tube at 1200 km/h. In 2015, SpaceX announced that they would sponsor a Hyperloop pod design competition, because of their interest in helping to accelerate the ... Read More

Development of a Mathematical Model for an Anode Baking Process with COMSOL Multiphysics®

P. Nakate [1], D. Lahaye [1], C. Vuik [1], M. Talice [2],
[1] Delft University of Technology, Netherlands
[2] PM2 Engineering, Italy

The anode baking process has gained significant attention since the 1980s due to its importance in Aluminium industry. A good anode baking process strives to achieve multiple goals including reduction of NOx from emissions. NOx generation is mainly due to the high-temperature ... Read More

Detailed Axial Symmetrical Model of Large-Scale Underground Thermal Energy Storage

A. Dahash [1], M. B. Janetti [1], F. Ochs [1],
[1] Unit of Energy-Efficient Buildings, Institute of Structural Engineering and Material Science, University of Innsbruck, Innsbruck, Austria

Seasonal thermal energy storage (STES) systems are key components for expanding the renewables share in the energy scheme as they offer the dispatchability and flexibility. Therefore, thermal behaviour of such systems is of interest. STES can influence the surroundings causing a ... Read More

Simulation of Laser-Excited Surface Acoustic Waves Travelling on a Steel Hemisphere Shell

J. Mäkinen [1], D. Veira Canle [1], R. Blomqvist [1], A. Salmi [1], E. Hæggström [1],
[1] Department of Physics, Division of Materials Physics, University of Helsinki, Helsinki, Finland

Non-contacting guided wave tomography based on laser ultrasonic waves can be used to inspect structures that are inaccessible to traditional ultrasound methods. Such structures could be, chemically or physically hard to reach, e.g. hot metal structures, metal implants inside tissue or ... Read More

Numerical Approaches to Modeling of WGM Resonator and Waveguide Coupling

N. M. Kondratiev [1],
[1] Russian Quantum Center (RQC), Skolkovo, Moscow, Russia

Whispering-gallery mode resonators (WGR) are promising elements for future photonic devices, as they combine ultra-high quality factor with small size and mode volume. Many practical applications of such microresonators, such as ultra-sensitive chemical and biological sensors [1] electro ... Read More

The Numerical Challenges in Multiphysical Modeling of Laser Welding with ALE

I. Tomashchuk [1], I. Bendaoud [2], J.-M. Jouvard [1], P. Sallamand [1],
[1] Laboratoire Interdisciplinaire Carnot de Bourgogne, Université de Bourgogne-Franche-Comté, Le Creusot, France
[2] Laboratoire de Mécanique et Génie Civil, Université de Montpellier, France

The interaction of high power laser beam with metallic materials produces a number of interconnected phenomena that represent a serious challenge for numerical modeling, especially for creation of auto-consistent models. Additional difficulty consists in lack of data on materials ... Read More

J-Integral Evaluation for Through Silicon Vias

R. Coppeta [1], C. Hartler [2], J. Siegert [1],
[1] ams AG, Premstaetten, Austria
[2] Technische Universitaet Graz, Graz, Austria

Through Silicon Via (TSV) is one of the key technologies for 3D integration. It is a vertical electrical connection that passes through a silicon wafer and establishes the signal transmission between the front and the backside of the device. In the so-called “TSV last” integration ... Read More

Hot Cracking in Nb-Si Alloys

I. Y. Fernando [1],
[1] University of Leicester, Leicester, UK

Introduction With the vast development in the aerospace industry it is inevitable that currently used materials such as Nickel based super alloys will soon reach its peak performance. Hence developing alternative materials with similar properties that could be enhanced further is ... Read More

Multiscale and Multiphysics Modeling of an Adaptive Material for Sound Absorption

T. G. Zielinski [1], K. C. Opiela [1],
[1] Institute of Fundamental Technological Research of the Polish Academy of Sciences, Warsaw, Poland

A concept of an adaptive sound absorbing material is proposed and investigated numerically using the COMSOL Multiphysics® Software suitable for the required advanced dual-scale modelling which involves solution of various problems of physics at the microscopic and macroscopic levels. A ... Read More

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