Fluid & Heat Blog Posts
Simulating the Thermocompression Bonding of an Underfill Adhesive
Underfill adhesives are often used in microelectronics to hold different components together. Simulate the thermocompression bonding process of such an adhesive to ensure its effectiveness.
Finding the Ideal Thickness for the Insulation of a Pipeline
Pipelines need to be properly insulated in order to transport products like petroleum and natural gas across long distances. Use COMSOL® to find the ideal thickness for a pipeline insulation.
How to Use the Well Feature in Subsurface Flow Models
The Well feature makes it easier to set up and mesh well geometries for subsurface flow modeling. Learn how to take advantage of this feature’s settings and capabilities.
Can a Wine Cooler Actually Keep Your Beverage Cold?
When enjoying nice meals outside, some people use wine coolers to keep their beverages cold. But can a wine cooler actually keep a bottle of wine chilled, and if so, for how long?
Simulating Cancer Cell Migration in Microgravity with COMSOL®
Researchers used multiphysics simulation to determine how microgravity effects the migration of metastatic cancer cells. Their results could have new implications for therapy and treatments.
How to Model Supersonic Flows in COMSOL Multiphysics®
Learn about the different types of sonic flow and how to calculate the angle and Mach number of a shock wave in order to model the supersonic flow around an object, such as a diamond airfoil.
Comparing 2 Approaches for Modeling Electronic Chip Cooling
We go over 2 modeling approaches for electronic chip cooling problems. 1 way models the solid parts and a Convective Cooling boundary condition, while the other option includes an air domain.
Efficiently Analyze Acoustic Streaming with Multiphysics Modeling
Acoustic streaming is when sound waves are used to generate steady fluid motion. You can use multiphysics modeling for an efficiency way to analyze this phenomenon.