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Modeling a Coil Heat Exchanger
Coil heat exchangers are simple and easy to manufacture — but what about modeling them? Adding expressions to compute the temperature drop between coil turns simplifies the modeling process.
Heat Transfer in Deformed Solids
Learn how to model the physics that account for thermoelastic effects in immobile solids when coupling heat transfer and solid mechanics. Follow-up to an earlier post on conjugate heat transfer.
Heat Transfer: Accounting for the Radiation of the Sun
Knowing the sun’s radiation and thermal effects is very important to designers within the building industry, especially in designing “green” buildings. Heat transfer also plays a vital role in designing outdoor devices in terms of maintaining temperatures in extreme hot or cold environments. To use the words of Nicolas Huc, project leader for the Heat Transfer Module development at COMSOL in France: “it makes a huge difference if you forget to take the sun’s radiation into account.”
How to Calculate Mass Conservation and Energy Balance
Ever wonder how to compute the mass conservation of a fluid flow simulation, or the energy balance of a conjugate heat transfer simulation? If so, keep reading >>
Improving the Beer Brewing Process with Simulation
Which side of home beer brewing are you more interested in: The culinary side, like the recipes and ingredients, or the engineering one, like the conjugate heat transfer and chemical reactions?
6 Ways Engineers Are Using Simulation to Help the Environment
Energy-efficient buildings and appliances. Safe nuclear waste storage. Well-preserved freshwater lakes. These are just a few examples of how simulation is being used to help the environment.
Calculating Thermodynamic Properties for Liquids and Gases
The Chemical Reaction Engineering Module includes a built-in database of over a dozen thermodynamic properties, making it easier to set up your transport and reaction models. Details here.
Comparing 2 Approaches for Modeling Electronic Chip Cooling
We go over 2 modeling approaches for electronic chip cooling problems. 1 way models the solid parts and a Convective Cooling boundary condition, while the other option includes an air domain.