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thermal expansion
Posted May 27, 2016, 2:47 a.m. EDT Heat Transfer & Phase Change, Modeling Tools & Definitions, Parameters, Variables, & Functions, Results & Visualization, Studies & Solvers Version 5.0 1 Reply
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I am trying to study the expansion of copper deposited on silicon wafer when heated in a furnace in thermal cycles. for example, if I set my furnace to increase the temperature by 10 C per minute until it reaches 150 C after that it cools down to 60 C at same rate and again it heats up at same rate. It continues for 5 hours. And finally I want to study the deformation/expansion in copper deposited on silicon wafer. How to simulate it in COMSOL?
1 Reply Last Post May 27, 2016, 8:02 a.m. EDT
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Posted:
9 years ago
Hello Umesh,
The busbar tutorial featured in the Introduction to COMSOL Multiphysics manual, version 5.2, illustrates how to set up a model with thermal expansion. Please note that it requires that your license carry either the Structural Mechanics Module or the MEMS Module.
All manuals are accessed through the File > Help >Documentation menu.
Best,
Jeff
The busbar tutorial featured in the Introduction to COMSOL Multiphysics manual, version 5.2, illustrates how to set up a model with thermal expansion. Please note that it requires that your license carry either the Structural Mechanics Module or the MEMS Module.
All manuals are accessed through the File > Help >Documentation menu.
Best,
Jeff