Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.

contact problem in thermal stress module

Please login with a confirmed email address before reporting spam

I want to simulation fracture or crack how to have effcts on the deformation of module under the thermal-manchanics coupling,but I donot know how to deal with contact due to crack run through the module ? could you give me some advices? thank you


0 Replies Last Post Oct 29, 2018, 11:17 p.m. EDT
COMSOL Moderator

Hello mingzhe3407

Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.

If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.

Note that while COMSOL employees may participate in the discussion forum, COMSOL® software users who are on-subscription should submit their questions via the Support Center for a more comprehensive response from the Technical Support team.