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Simulating metal-insulator-solution boundary

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Hi,

I have got the same issue for simulating metal-insulator-solution boundary. I am not sure which boundary condition is proper for this. and if EC or ES module is a better choice? To explain the model better, I have copper covered with a polymer insulator layer which is in contact with the solution. Voltage is applied to the copper. I would appreciate if anyone can help me please.

Thanks, Jino


0 Replies Last Post Mar 12, 2019, 10:35 a.m. EDT
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Hello Jino Fathy

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