Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.

Thermal expansion in thin films

Please login with a confirmed email address before reporting spam

Hello,

I am trying to study the associated stresses due to thermal expansion in a layered film structure. I have set a temperature boundary of 1000degC as a bottom heating condition and used rigid motion suppression to take into account a min number of constraints as i am analyzing the free expansion of the film.

After computation, my model only shows me a profile for temperature but does not evaluate the stresses, i don't know what information i missed. Could somebody please take a look at this?

thankyou Vishakha



1 Reply Last Post Aug 25, 2021, 11:33 a.m. EDT
Dave Greve Certified Consultant

Please login with a confirmed email address before reporting spam

Posted: 3 years ago Aug 25, 2021, 11:33 a.m. EDT

Try adding a Thermal Expansion node under Linear Elastic Material.

Try adding a Thermal Expansion node under Linear Elastic Material.

Note that while COMSOL employees may participate in the discussion forum, COMSOL® software users who are on-subscription should submit their questions via the Support Center for a more comprehensive response from the Technical Support team.