Transient Conduction in a Wall, Lumped Thermal System
Application ID: 78341
This model performs a transient analysis of the temperature through a house wall. The wall is formed of different layers corresponding to the structure, insulation and plaster. On the exterior and the interior, the wall is exposed to thermal radiation and convective cooling. The results obtained using the Lumped Thermal System interface are compared with results obtained with a FEM approach.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.