Electrodeposition of a Microconnector Bump with Deforming Geometry in 3D
Application ID: 16967
This model simulates the shape evolution of a microconnector bump over time as copper deposits on an electrode surface. Transport of cupric ions in the electrolyte occurs by convection and diffusion. The electrode kinetics are described by a concentration dependent Butler-Volmer expression.
The model is an extension to 3D of the Electrodeposition of a Microconnector Bump in 2D example.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® and
- either the Battery Design Module, Corrosion Module, or Electrodeposition Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.