Four-Point Bending Test of an IGBT Module
Application ID: 124181
The four-point bending test is a conventional test method used to test the mechanical properties of materials subjected to bending. It is a reliability test used for semiconductor packaging and assembly. This model demonstrates the stress analysis of an IGBT module subjected to a four-point bending test.
The test condition is based on the Standard BS ISO 23212: 2020.
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