Modeling of Flow Field and Abrasive Particles in Chemical Mechanical Polishing (CMP) Equipment
Application ID: 140171
Chemical mechanical polishing (CMP) is a crucial technique for surface planarization, widely used in semiconductor fabrication and optical device manufacturing.
This model simulates the flow field within the CMP retaining ring and tracks the motion of abrasive particles carried by the flow. The rotating flow field is modeled using the frozen rotor approach.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.