Thermal Expansion of Bond Wires in LEDs
Application ID: 140211
This model analyzes Joule heating and thermal expansion in a bond wire in an LED. Its purpose is to estimate the temperature increase and the resulting mechanical stresses in the bond wire due to thermal expansion. The magnitude of these stresses can be used to assess the risk of fatigue in the wedge and ball solder that connects the LED to the frame.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.