The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Read More
In this example, a benchmark problem in dynamic fracture of brittle materials is analyzed using the AT1 phase-field damage model. An instantaneous tensile load is applied to a planar tension specimen with a pre-existing crack. Initially, the crack propagates perpendicular to the loading ... Read More
This model demonstrates the inflation of a rubber balloon with four different hyperelastic material models. The results are compared with the analytical solution for a thin-walled, spherical vessel. Controlling the inflation of hyperelastic balloons is important in clinical ... Read More
This example shows how to implement a stress dependent material model. The Young's modulus changes based on the stress value. Read More
Micromirrors are used in certain MEMS devices to control optic elements. This model of a vibrating micromirror surrounded by air uses the Thermoacoustic-Shell Interaction user interface to model the fluid-solid interaction, and it thus includes the correct viscous and thermal damping of ... Read More
This model shows how to use the scattered field formulation to compute the transmission coefficient for impinging P and S plane elastic waves onto a finite size phononic crystal. The transmission tends to zero in the frequency range corresponding to P- and S-wave band gaps, as ... Read More
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Read More
Layered shell elements, which are used for modeling composite shells, often connected to solid and shell elements in cladding or side-by-side configuration to represent a realistic structure. For such applications, it becomes important to connect layered shell element correctly and ... Read More
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... Read More
Predicting the noise radiation from a dynamic system gives designers insight into the behavior of moving mechanisms early in the design process. For example, consider a gearbox in which the change in the gear mesh stiffness causes vibrations. These vibrations are transmitted to the ... Read More