The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This model is of the P.57 Type 4.3 Full-band Ear Simulator. The model includes the geometry of the ear canal as well as the pinna defined in the ITU-T P.57 standard. The model also includes interpolation data for an ear drum impedance ensuring correct acoustic properties of the ear. The ... Read More
This example shows how to implement a stress dependent material model. The Young's modulus changes based on the stress value. Read More
A tweeter is a high frequency driver used in loudspeaker systems. An ideal tweeter will produce a constant sound pressure level at a given distance in front of the driver independently of frequency, that is, a flat response. Ideally the tweeter will also, to a certain degree, maintain ... Read More
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... Read More
This example demonstrates how to use a background field in a sound scattering problem. The application is an acoustic invisibility cloak made of a metamaterial. Two different types of metamaterials are used, one using an anisotropic acoustic material with varying properties and one using ... Read More
This tutorial application demonstrates the modeling of a hinge joint between two bodies in COMSOL Multiphysics. Various nodes available for joints such as Constraints, Locking, Spring, Damper, Prescribed Motion, and Friction are also demonstrated. Many real structures can be ... Read More
Including circumferential displacements in a 2D axisymmetric Solid Mechanics interface allows to compute twist and bending deformations. This model determines stress concentration factors for a hollow shaft for load cases of axial extension, torsion, as well as bending, using a ... Read More
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Read More
The magnets in an Interior Permanent Magnet (IPM) motor are embedded in the rotor core, where they form narrow regions known as bridges. The thickness of the magnetic bridge is an important parameter to consider in design, both from the electromagnetic and the mechanical perspectives. As ... Read More
A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It ... Read More