The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
Electronic equipment often has to be certified to function after having been subjected to a specified shock load. In this example, the effect of an 50g 11ms half sine shock on a circuit board is investigated using response spectrum analysis. The results are compared with a time domain ... Read More
In this example, wear of the friction material in a disc brake is studied. Quasistatic friction forces are prescribed from simple kinematic considerations. The geometry of the brake pad is continuously updated to account for the material removal due to wear following the well-known ... Read More
In this example of a peristaltic pump, rollers squeeze a flexible tube and the compression drives a fluid through the tube. The model demonstrates how to use the Fluid-Structure Interaction interface. The main advantage of the peristaltic pump is that no seals, valves or other internal ... Read More
This example performs the analysis of a viscoelastic damper. The damper is intended for reduction of wind-induced and seismic vibrations in buildings and other tall structures. Read More
This example studies the deflection of a cantilever beam undergoing very large deflections. The beam is modeled using both the Solid Mechanics interface and the Beam interface. The results are compared with each other and with a benchmark solution from NAFEMS. In addition, a linear ... Read More
This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library. The purpose of ... Read More
This tutorial example shows how to perform a random vibration analysis of a structure using power spectral density (PSD). The computations are based on the modal reduced order model (ROM). Read More
This model analyzes the frequency response of a fuel tank partially filled with fluid. The tank is submitted to a vertical acceleration. Two modeling methods are considered to represent the fluid: a traditional method of smearing the mass of the fluid through the wetted surface of the ... Read More
This example shows how to compute thermally induced stresses in a turbine stator blade using the Thermal Stress, Solid interface. The conditions within gas turbines are extreme. The pressure can be as high as 40 bar, and the temperature more than 1000 K. Any new component must therefore ... Read More
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Read More