Technical Papers and Presentations

Since a couple of years, sintering becomes more and more important for power electronics. To press a semiconductor under high temperature in silver paste on a substrate promises benefits for durability. Tests with semiconductors of different thickness expose some problems. After the cool ... Read More

Rotaxanes are a class of molecules recently developed in laboratory that have been heralded as possible molecular motors. The motor is constituted by a linear molecule (thread) and a ring-shaped molecule (macrocycle), which is free to move along the thread, switching between two, or ... Read More

The current paper focuses on the creation of a consistent environment for the numerical prediction of the physical properties of polymer composite. A limitation factor for the successful simulation of composite processes is the correct estimation of the effective properties depending on ... Read More

Large deflection actuators are becoming increasingly important for microsystems. Since actuation forces are usually small, large deflection actuators usually require flexures with low stiffness. Rectangular serpentine flexures are often used for such actuators due to their low stiffness ... Read More

Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification in free energy density finite element implementation: PDE form weak form periodic boundary conditions: electrical mechanical domain configurations intrinsic and extrinsic ... Read More

The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured ... Read More

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... Read More

Capacitor Discharge Sintering (CDS) is an ultrafast Electric Current Assisted Sintering method (u-ECAS) suited for electrically conductive powders. It is characterized by relatively short processing times (milliseconds range) and much lower sintering temperatures than the melting point ... Read More

The excessive presence of residual SiC matrix inter-fiber pores is often the main cause for the very poor mechanical strength and toughness of SiC/SiC composites manufactured by CVI (Chemical Vapour Infiltration) process. This work presents a micro/macro Microwaveassisted Chemical Vapour ... Read More

Dynamic measurement of magnetic particles in continuous flow devices is made very difficult by the limitations imposed by the sensors themselves. Thus, certain sensor layouts are restricted to either number sensitive or spatial resolutive measurements of magnetic particles. We ... Read More