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See How Multiphysics Simulation Is Used in Research and Development

Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.

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Simulation of Droplet Impingement on a Solid Surface by the Level Set Method

J. Hu[1], R. Jia[1], K. Wan[2], X. Xiong[3]
[1]Department of Mechanical Engineering, University of Bridgeport, Bridgeport, CT, USA
[2]Mechanical and Industrial Engineering, Northeastern University, Boston, MA, USA
[3]Department of Electrical Engineering, University of Bridgeport, Bridgeport, CT, USA

The dynamic behavior of droplet impingement on a solid surface is important to many engineering applications. This paper studied the dynamic behavior of a droplet impinging onto solid dry surfaces with different surface wettability using the COMSOL Multiphysics® software. The simulation ... Read More

Modeling Internal Heating of Optoelectronic Devices Using COMSOL

N. Brunner[1][,][2]
[1]Voxtel, Inc, Beaverton, OR, USA
[2]University of Oregon, Eugene, OR, USA

In this paper the heat transfer module in COMSOL is utilized to simulate internal heating of an Avalanche Photodiode due to light-induced current through a resistivity that depends on charge carrier concentrations in the device. Initial tests are done by modeling the heating process on a ... Read More

Heat and Mass Transfer in Reactive Multilayer Systems (RMS)

M. Rühl[1], G. Dietrich[2], E. Pflug[1], S. Braun[2], A. Leson[2]
[1]TU Dresden, Laser and Surface Technology, Dresden, Germany
[2]IWS Dresden, Fraunhofer Institute for Material and Beam Technology, Dresden, Germany

Established joining techniques like welding, soldering or brazing typically are characterized by a large amount of heat load of the components. Especially in the case of heat sensitive structures like MEMS this often results in stress induced deformation and degradation or even damaging ... Read More

Pseudo-3D Multiphysics Simulation of a Hydride Vapor Phase Epitaxy Reactor

M. Hackert-Oschätzchen[1], M. Penzel[1], P. Plänitz[2], A. Schubert[1][3]
[1]Chemnitz University of Technology, Chemnitz, Germany
[2]GWT-TUD, Dresden, Germany
[3]Fraunhofer Institute for Machine Tools and Forming Technology IWU, Chemnitz, Germany

Gallium nitride (GaN) and its related nitride alloys with special physical properties are in technical areas of high interest. The growing of gallium nitride boules on non-native sapphire or silicon carbide requires complicated mechanisms of defect reduction in the lattice structure. ... Read More

Tunable Metamaterial-Inspired Resonators for Optimal Wireless Power Transfer Schemes

A. X. Lalas [1], N. V. Kantartzis [2], T. T. Zygiridis [3], T. P. Theodoulidis [4],
[1] Information Technologies Institute, Centre of Research & Technology - Hellas, 6th km Harilaou - Thermi, Thessaloniki, Greece
[2] Department of Electrical and Computer Engineering, Aristotle University of Thessaloniki, Thessaloniki, Greece
[3] Department of Informatics and Telecommunications Engineering, University of Western Macedonia, Kozani, Greece
[4] Department of Mechanical Engineering, University of Western Macedonia, Kozani, Greece

The advent of wireless power transfer (WPT) technology has offered a gradually evolving research field with a multitude of triggering applications, like electric vehicles, bio-medical implants and wireless charging media for consumer electronics. However, since the initial establishment ... Read More

Electromagnetic Release Process for Flexible Electronics

G. Coryell[1][,][2]
[1]School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, USA
[2]Chemistry Department, United States Naval Academy, Annapolis, MD, USA

Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a ... Read More

Demonstration of All-Optical NAND Logic Gate Using Photonic Integrated Circuits

J. T. Andrews[1], R. Choubey[1], O P Choudhary[1], N. Malviya[1], A. Patel[1], M. Kumar[1], S. Chouksey[1], J. Solanki[1]
[1]National MEMS Design Center, Department of Applied Physics, Shri G S Institute of Technology & Science, Indore 452003 MP, India

A logic gate performs a certain Boolean logic operation on one or more logical inputs and produces a single logical output. The logic values are either “true” or “false.” Logic gates are bistable devices, that is, they may yield one of these two possible stable outputs. The NAND logic is ... Read More

Engineering Light Photonics, Plasmonics and Meta-materials

Dr. A. Prabhakar
Dept. of Electrical Engineering, IIT-Madras, Chennai, Tamil Nadu, India

Anil Prabhakar joined the faculty at IIT-Madras in 2002, after 5 years of post-doctoral experience in the hard disk drive industry. His current research interests include photonics, spintronics, nonlinear dynamics and alternative and augmentative communication. As a member of the Optics ... Read More

COMSOL Multiphysics in Plasmonics and Metamaterials

S. Sun [1,2], and G. Guo [2,3]
[1]Physics Division, National Center for Theoretical Sciences (North), National Taiwan University, Taipei 10617, Taiwan
[2]Department of Physics, National Taiwan University, Taipei 10617, Taiwan
[3]Graduate Institute of Applied Physics, National Chengchi University, Taipei 11605, Taiwan

This paper will present research about: * Effective-medium properties of metamaterials: A quasi-mode theory * 2D complete band gaps from 1D photonic crystal * Optical microcavities Read More

Numerical Prediction of Weld Bead Geometry in Plasma Arc Welding of Titanium Sheets

V. Dhinakaran[1], S. Khope[1], N. S. Shanmugam[1] , K. Sankaranarayanasamy[1]
[1]National Institute of Technology, Tiruchirappalli, Tiruchirappalli, Tamil Nadu, India

Plasma Arc Welding (PAW) is one of the important arc welding processes commonly used in electronics, medical, automotive and aerospace industries due its high accuracy, finishing, and ability of welding any hard materials. It is an extension of Tungsten Inert Gas welding (TIG or GTAW). ... Read More

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