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Surface-mounted packages are small in size and make automated mounting efficient, thereby reducing the fabrication cost of a total system. However, the circuit-board designer might have to consider the placements of these types of devices.
One heat-producing device is a voltage regulator, which can reach a temperature greater than 70oC. If such a device is placed close to a surface-mounted package that holds a sensitive silicon chip, the heat produced in the voltage regulator can cause reliability problems.
This model investigates how a voltage regulator influences a neighboring surface-mounted package. The model also includes the heat emitting from the silicon chip. The Heat Transfer Module was used to model the example because it contains the Thin Conducting Layer application mode, which here describes the heat transfer through the interconnect and copper film on the circuit board. |
