COMSOL News
Multiphysics Simulation: An IEEE Spectrum Insert
Manager’s Guide
Thermal Characterization of an Electronic Device with a Custom App
Giuseppe Petrone, BE CAE & Test, ItalyBE CAE & Test, a COMSOL Certified Consultant, created a thermal model of a surface-mount device for a client and converted it into a simulation app with the Application Builder in COMSOL Multiphysics®, providing an interactive deliverable that could be used to investigate the system. Their clients are pleased to use an interactive tool with which they can investigate their system.
In the simulation app, the end user can vary the material of the solder layer and silicon die, thickness of the solder layer, and dissipated thermal power to examine the impact on maximum junction temperatures and junction-to-case thermal resistance.
The Surface-Mount Device Thermal Model app, created with the Application Builder available in COMSOL Multiphysics® software. The user can change factors such as a solder thickness, operating conditions, and materials in order to analyze the thermal behavior of different SMD designs.
Download
- BECAE_CN16.pdf - 1.75MB