MEMS Microphone with Slip Wall
Application ID: 119191
This is a model of a MEMS microphone solved in the frequency domain including the DC prestress effects. The model is set up using the Electromechanics multiphysics interface, Thermoviscous Acoustics, and Pressure Acoustics. The microphone consists of a perforated plate and a prestressed membrane. The model uses the Slip Wall boundary condition to include the effects of high Knudsen numbers in the MEMS microphone. The slip velocity can be important for the flow through the holes in the microperforated plate (MPP) and for the squeezing flow between the perforated plate and the membrane.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® and
- Acoustics Module and
- either the AC/DC Module, or MEMS Module and
- either the MEMS Module, or Structural Mechanics Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.