Optimization of the Solder Ball Array to Minimize Chip Warpage
Application ID: 124581
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only for reinforcement. In this model, the placement of the support solder balls in the array are optimized to minimize the warpage of the chip during operation.
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